Ceramic Semiconductor Packages

Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016.

Ceramic semiconductor packages. For 30 years our proven track record consistent customer service and long standing supplier relationships makes us the premier distributor for your ic packaging needs. Micro ball grid array μbga. The body of the component is ceramic. Cerpac packages sold in three separate components cerpac base cerpac frame and cerpac cap.

However the simple construc. Don forbes rex rice and bryant rogers invented a 14 lead ceramic dual in line package dip with two rows of pins. High pin count semiconductor packaging. Located in silicon valley spectrum semiconductor materials inc.

A circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern. Ball spacing less than 1 mm. Ultra small ceramic packages help miniaturize highly functional crystal devices which are essential in electronics. Spectrum semiconductor materials extensive inventory of ceramic cerpac packages are available in 14 18 20 24 and 28 pin configurations.

Ametek offers both glass to metal seal and ceramic to metal seal technology to its customers. These ceramic and metal can packages are of. Dip packages came into volume production in early 70 s. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition.

Hermetic packages national semiconductor offers a wide variety of ceramic and metal can packages for through hole and surface mount ap plications. Is a world wide authorized distributor of packages and lids for ic assembly. A package with metric pin distribution 0 5 mm pitch. Three engineers from fairchild.

The first semiconductor package. Depending on the application weight thermal solution and material requirements ametek can help you design a package using one of these technologies to best meet your requirements. Ceramic column grid array ccga. A semiconductor package is a metal plastic glass or ceramic casing containing one or more discrete semiconductor devices or integrated circuits individual components are fabricated on semiconductor wafers commonly silicon before being diced into die tested and packaged the package provides a means for connecting it to the external environment such as printed circuit board via leads.

These packages protect the crystal with full hermetic sealing for high reliability while measuring just 1 0 x 0 8 mm among the world s smallest. Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition.